Molex Introduces First Chip-to-Chip Portfolio of 224G Connectors to Accelerate Support for Next-Gen Data Center and AI
Molex Introduces First Chip-to-Chip Portfolio of 224G Connectors to Accelerate Support for Next-Gen Data Center and Generative AI Applications
Keyword: Molex 224G Connector AI Time: 2023-05-31 Source: Molex
"Molex, a global electronics leader and connectivity innovator, introduces the industry's first chip-to-chip 224G product portfolio, including next-generation cables, backplanes, board-to-board connectors and near-ASIC connector-to-cable alongside ASICs solutions, transmission speeds up to 224 Gbps-PAM4. Molex is thus uniquely positioned to meet the industry’s higher demand for the fastest available data rates, thereby meeting demand for generative AI, machine learning (ML), 1.6T networks and other high-speed application systems are increasingly demanding.
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• High-speed I/O, unisex backplane cables, mezzanine board-to-board connectors, and Near-ASIC connector-to-cable solutions to interface signaling circuits at 224 Gbps-PAM4 transfer rates
• Predictive analytics, customer collaboration and simulation drive full-channel development of individual modules to ensure the highest levels of electrical, mechanical, physical and signal integrity
• Portfolio of connectors designed to support the development efforts of technology leaders, hyperscale data centers and other enterprise customers to meet the market's growing demand for generative AI, ML (machine learning), 1.6T networking and other high-speed application systems needs
Global Electronics Leader and Connectivity Innovator Molex Introduces Industry’s First Chip-to-Chip 224G Portfolio, Including Next-Generation Cable, Backplane, Board-to-Board Connector and Near-ASIC Connector-to-Cable Solutions Next to ASICs solution, transmission speed up to 224 Gbps-PAM4. Molex is therefore uniquely positioned to meet the industry's higher demand for the fastest available data rates, which in turn meet the growing demand for generative AI, machine learning (ML), 1.6T networking and other high-speed application systems.
MOL512. Molex Unveils Full-Channel 224G
"Molex is working closely with major technology innovators, as well as key data center and enterprise customers, to prepare for the launch of 224G products," said Jairo Guerrero, vice president and general manager, Molex Copper Solutions, Molex. approach that helps us engage stakeholders in the 224G ecosystem early on to identify and resolve potential performance bottlenecks and design challenges, from signal integrity to EMI reduction to more effective thermal management Requirements in all aspects."
Innovations in connectivity fuel the development of the 224G ecosystem
Achieving data rates up to 224 Gbps-PAM4 will require new system architectures for multiple chip-to-chip connections, an important and complex technology inflection point. To this end, a cross-functional global team of Molex engineers works closely with customers, technology leaders and suppliers to accelerate the design and development of complete, best-in-class connectivity solutions using the latest predictive analytics and advanced software simulation methods , which includes:
• Mirror Mezz Enhanced Connector - A new addition to the Mirror Mezz™ series of mid-layer board-to-board connectors without male-female distinction, this product can connect to 224 Gbps-PAM4 rate circuits while meeting different connection heights requirements, it overcomes PCB space constraints as well as manufacturing and assembly challenges, resulting in lower application cost and faster time-to-market.
Mirror Mezz Enhanced connectors extend the capabilities of Mirror Mezz and Mirror Mezz Pro, which were selected as Open Control Module (OCM) standards by the Open Accelerator Infrastructure Group in the Open Compute Project (OCP). This reinforces Molex's overall commitment to partner with industry leaders to support the explosive growth of AI and other accelerator infrastructure systems.
• Inception™ Backplane Connectors—Molex's first gender-neutral backplane connection system designed from a cable-first perspective, offering greater application flexibility from the start, with variable terminal spacing ( density), optimal signal integrity, and simplified integration with multiple system architectures. The introduction of simplified SMT technology reduces the need for complex drilling of printed circuit boards and through-hole processing at the PCB interface. Molex offers multiple wire gauge options that allow you to select the appropriate wire gauge to match with custom cable lengths inside and outside the application to optimize channel performance.
• CX2 Two-Speed Connector — Molex's 224 Gbps-PAM4 near-ASIC connector provides a robust and reliable connection to cable systems, featuring post-mating screw locking, integrated strain relief, reliable mechanical friction travel and The benefits of a fully protected "thumb-proof" docking interface for long-term, reliable connections. High-performance twinax cables and innovative shielding structure provide excellent isolation of Tx/Rx circuits.
• OSFP 1600 Solutions – These I/O products include SMT connectors and cages, BiPass, and Direct Attach Cable (DAC) and Active Cable (AEC) solutions up to 224 Gbps-per-lane-PAM4 or per-connection total speed of 1.6T. Improved shielding minimizes crosstalk while improving signal integrity at higher Nyquist frequencies. These latest connector and cable solutions are designed for increased mechanical robustness and durability.
• QSFP 800 and QSFP-DD 1600 solutions – This family has also been upgraded to offer SMT connectors and cages, Bipass, and Direct Attach Cable (DAC) and Active Cable (AEC) solutions up to 224 Gbps per lane -PAM4 or total connection speed of 1.6T per connector. Molex's QSFP and QSFP-DD solutions ensure mechanical robustness, improve signal integrity, reduce thermal load, increase design flexibility and lower rack costs.
Availability
Samples of Mirror Mezz Enhanced connectors, Inception backplane connectors and CX2 Dual Speed two-speed connectors will be available this summer, and samples of Molex's new OSFP and QSFP products will be released in the fall.
About Molex
Molex is a global electronics industry leader committed to making the world a better and more connected place. Molex operates in more than 40 countries, delivering revolutionary innovations to industries including automotive, data center, industrial automation, healthcare, 5G, cloud computing and consumer devices. With trusted customer and industry relationships, unparalleled engineering expertise, and the high quality and reliability of its products, Molex realizes the unlimited potential of Creating Connections for Life.
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