253 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
Default Photo
Per Unit
$55.24
RFQ
75,780
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 48POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 48 (2 x 24) Beryllium Nickel
Default Photo
Per Unit
$26.57
RFQ
39,060
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 48POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 48 (2 x 24) Beryllium Copper
Default Photo
Per Unit
$26.57
RFQ
70,040
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 48POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 48 (2 x 24) Beryllium Copper
Default Photo
Per Unit
$25.73
RFQ
33,120
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 44POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 44 (2 x 22) Beryllium Copper
Default Photo
Per Unit
$20.48
RFQ
62,760
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 40POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Nickel
Default Photo
Per Unit
$20.48
RFQ
65,180
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 40POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Copper
Default Photo
Per Unit
$20.48
RFQ
67,080
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 40POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Copper
Default Photo
Per Unit
$20.48
RFQ
56,620
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 40POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Copper
Default Photo
Per Unit
$20.48
RFQ
76,940
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 40POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Copper
Default Photo
Per Unit
$20.48
RFQ
57,480
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 40POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Copper
Default Photo
Per Unit
$19.52
RFQ
76,700
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Nickel
Default Photo
Per Unit
$19.52
RFQ
76,960
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Copper
Default Photo
Per Unit
$19.52
RFQ
38,380
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Copper
Default Photo
Per Unit
$19.52
RFQ
65,100
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Copper
Default Photo
Per Unit
$19.52
RFQ
15,240
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Copper
Default Photo
Per Unit
$17.34
RFQ
38,360
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Nickel
Default Photo
Per Unit
$17.34
RFQ
18,740
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper
Default Photo
Per Unit
$17.34
RFQ
14,260
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper
Default Photo
Per Unit
$17.34
RFQ
25,720
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper
Default Photo
Per Unit
$17.34
RFQ
18,020
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper
Default Photo
Per Unit
$17.34
RFQ
59,920
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper
Default Photo
Per Unit
$37.09
RFQ
75,080
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Nickel
Default Photo
Per Unit
$37.09
RFQ
26,640
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Nickel
Default Photo
Per Unit
$37.09
RFQ
60,700
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Nickel
Default Photo
Per Unit
$37.09
RFQ
20,280
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Nickel
Default Photo
Per Unit
$37.09
RFQ
32,240
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper
Default Photo
Per Unit
$37.09
RFQ
20,320
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Nickel
Default Photo
Per Unit
$35.06
RFQ
32,740
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 36POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper
Default Photo
Per Unit
$35.06
RFQ
47,620
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Nickel
Default Photo
Per Unit
$35.06
RFQ
37,960
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Nickel
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