46 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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RFQ
17,120
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole, Right Angle, Vertical Solder Carrier, Closed Frame DIP, 0.3" (7.62mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 18 (2 x 9) Beryllium Copper 20.0µin (0.51µm) Beryllium Copper
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RFQ
56,780
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.6" (15.24mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 40 (2 x 20) Beryllium Copper 20.0µin (0.51µm) Beryllium Copper
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RFQ
64,020
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.6" (15.24mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 32 (2 x 16) Beryllium Copper 20.0µin (0.51µm) Beryllium Copper
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RFQ
77,680
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.6" (15.24mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 28 (2 x 14) Beryllium Copper 20.0µin (0.51µm) Beryllium Copper
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RFQ
62,440
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.6" (15.24mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 24 (2 x 12) Beryllium Copper 20.0µin (0.51µm) Beryllium Copper
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RFQ
74,100
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.3" (7.62mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 20 (2 x 10) Beryllium Copper 20.0µin (0.51µm) Beryllium Copper
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RFQ
13,960
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.3" (7.62mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 6 (2 x 3) Beryllium Copper 20.0µin (0.51µm) Beryllium Copper
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RFQ
68,600
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.3" (7.62mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 16 (2 x 8) Beryllium Copper 20.0µin (0.51µm) Beryllium Copper
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RFQ
16,040
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.3" (7.62mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 8 (2 x 4) Beryllium Copper 20.0µin (0.51µm) Beryllium Copper
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RFQ
67,880
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.3" (7.62mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 8 (2 x 4) Beryllium Copper 20.0µin (0.51µm) Beryllium Copper
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RFQ
16,280
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.3" (7.62mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 20 (2 x 10) Beryllium Copper 20.0µin (0.51µm) Beryllium Copper
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Per Unit
$6.89
RFQ
59,940
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Preci-Dip CONN SOCKET PGA 100POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 100 (10 x 10) Beryllium Copper - Brass
714-43-254-31-018000
Per Unit
$5.65
RFQ
59,360
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 54POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 54 (2 x 27) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-240-31-018000
Per Unit
$4.55
RFQ
38,040
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 40 (2 x 20) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-238-31-018000
Per Unit
$4.40
RFQ
42,760
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 38POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 38 (2 x 19) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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Per Unit
$4.30
RFQ
12,440
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Preci-Dip CONN SOCKET PGA 64POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 64 (8 x 8) Beryllium Copper - Brass
714-43-236-31-018000
Per Unit
$4.24
RFQ
63,360
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 36POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 36 (2 x 18) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-224-31-018000
Per Unit
$3.30
RFQ
42,900
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-222-31-018000
Per Unit
$3.15
RFQ
37,060
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 22 (2 x 11) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-212-31-018000
Per Unit
$2.36
RFQ
14,740
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 12POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 12 (2 x 6) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-262-31-018000
Per Unit
$6.27
RFQ
36,740
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 62POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 62 (2 x 31) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-210-31-018000
Per Unit
$2.21
RFQ
22,420
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10 (2 x 5) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-256-31-018000
Per Unit
$5.81
RFQ
21,940
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 56POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 56 (2 x 28) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-242-31-018000
Per Unit
$4.71
RFQ
56,880
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 42POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 42 (2 x 21) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-258-31-018000
Per Unit
$5.96
RFQ
60,400
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 58POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 58 (2 x 29) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-228-31-018000
Per Unit
$3.62
RFQ
44,660
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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Per Unit
$3.56
RFQ
52,860
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Preci-Dip CONN SOCKET PGA 64POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 64 (8 x 8) Beryllium Copper - Brass
714-43-226-31-018000
Per Unit
$3.46
RFQ
48,640
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 26POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 26 (2 x 13) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-244-31-018000
Per Unit
$4.87
RFQ
75,260
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 44POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 44 (2 x 22) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-216-31-018000
Per Unit
$2.68
RFQ
35,480
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 16 (2 x 8) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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