4 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
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RFQ
43,220
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET ZIF 40POS GLD OEM Obsolete Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyether Imide (PEI), Glass Filled 0.100" (2.54mm) Gold 250.0µin (6.35µm) 40 (2 x 20) Beryllium Copper
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RFQ
16,120
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET ZIF 20POS GLD OEM Obsolete Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyether Imide (PEI), Glass Filled 0.100" (2.54mm) Gold 250.0µin (6.35µm) 20 (2 x 10) Beryllium Copper
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Per Unit
$5.87
RFQ
19,880
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET ZIF 32POS GLD OEM Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyether Imide (PEI), Glass Filled 0.100" (2.54mm) Gold 250.0µin (6.35µm) 32 (2 x 16) Beryllium Copper
216-6278-00-3303
Per Unit
$5.95
RFQ
41,440
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET ZIF 16POS GLD OEM Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyether Imide (PEI), Glass Filled 0.100" (2.54mm) Gold 250.0µin (6.35µm) 16 (2 x 8) Beryllium Copper
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