62 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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RFQ
22,560
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3M CONN SOCKET SIP 32POS GOLD - Obsolete - - Through Hole - Closed Frame SIP - 0.100" (2.54mm) Gold 8.00µin (0.203µm) 32 (1 x 32) - 8.00µin (0.203µm) -
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RFQ
69,260
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3M CONN IC DIP SOCKET 40POS GOLD 400 Obsolete - - Through Hole - Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold 8.00µin (0.203µm) 40 (2 x 20) - 8.00µin (0.203µm) -
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RFQ
37,760
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3M CONN IC DIP SOCKET 32POS GOLD 400 Obsolete - - Through Hole - Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold 8.00µin (0.203µm) 32 (2 x 16) - 8.00µin (0.203µm) -
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RFQ
73,520
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3M CONN IC DIP SOCKET 28POS GOLD 400 Obsolete - - Through Hole - Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold 8.00µin (0.203µm) 28 (2 x 14) - 8.00µin (0.203µm) -
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RFQ
59,920
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3M CONN SOCKET SIP 32POS GOLD 300 Obsolete - - Through Hole - Closed Frame SIP - 0.100" (2.54mm) Gold 8.00µin (0.203µm) 32 (1 x 32) - 8.00µin (0.203µm) -
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RFQ
43,440
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3M CONN SOCKET SIP 14POS GOLD 300 Obsolete - - Through Hole - Closed Frame SIP - 0.100" (2.54mm) Gold 8.00µin (0.203µm) 14 (1 x 14) - 8.00µin (0.203µm) -
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RFQ
21,460
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3M CONN IC DIP SOCKET 28POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 28 (2 x 14) Beryllium Copper Flash Brass
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RFQ
43,600
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3M CONN IC DIP SOCKET 24POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 24 (2 x 12) Beryllium Copper Flash Brass
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RFQ
47,460
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3M CONN IC DIP SOCKET 24POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 24 (2 x 12) Beryllium Copper Flash Brass
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RFQ
32,780
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3M CONN IC DIP SOCKET 48POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 48 (2 x 24) Beryllium Copper Flash Brass
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RFQ
44,140
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3M CONN IC DIP SOCKET 42POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 42 (2 x 21) Beryllium Copper Flash Brass
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RFQ
58,660
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3M CONN IC DIP SOCKET 40POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 40 (2 x 20) Beryllium Copper Flash Brass
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RFQ
59,880
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3M CONN IC DIP SOCKET 40POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 40 (2 x 20) Beryllium Copper Flash Brass
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RFQ
43,660
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3M CONN IC DIP SOCKET 32POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 32 (2 x 16) Beryllium Copper Flash Brass
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RFQ
68,800
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3M CONN IC DIP SOCKET 32POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 32 (2 x 16) Beryllium Copper Flash Brass
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RFQ
31,700
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3M CONN IC DIP SOCKET 28POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 28 (2 x 14) Beryllium Copper Flash Brass
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RFQ
60,580
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3M CONN IC DIP SOCKET 28POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 28 (2 x 14) Beryllium Copper Flash Brass
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RFQ
41,080
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3M CONN IC DIP SOCKET 24POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 24 (2 x 12) Beryllium Copper Flash Brass
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RFQ
39,700
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3M CONN IC DIP SOCKET 24POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 24 (2 x 12) Beryllium Copper Flash Brass
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RFQ
68,620
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3M CONN IC DIP SOCKET 22POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 22 (2 x 11) Beryllium Copper Flash Brass
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RFQ
60,380
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3M CONN IC DIP SOCKET 20POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 20 (2 x 10) Beryllium Copper Flash Brass
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RFQ
45,620
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3M CONN IC DIP SOCKET 20POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 20 (2 x 10) Beryllium Copper Flash Brass
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RFQ
57,060
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3M CONN IC DIP SOCKET 18POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 18 (2 x 9) Beryllium Copper Flash Brass
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RFQ
43,560
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3M CONN IC DIP SOCKET 18POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 18 (2 x 9) Beryllium Copper Flash Brass
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RFQ
28,920
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3M CONN IC DIP SOCKET 16POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 16 (2 x 8) Beryllium Copper Flash Brass
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RFQ
19,180
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3M CONN IC DIP SOCKET 16POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 16 (2 x 8) Beryllium Copper Flash Brass
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RFQ
47,740
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3M CONN IC DIP SOCKET 14POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 14 (2 x 7) Beryllium Copper Flash Brass
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RFQ
74,860
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3M CONN IC DIP SOCKET 14POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 14 (2 x 7) Beryllium Copper Flash Brass
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RFQ
79,520
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3M CONN IC DIP SOCKET 10POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 10 (2 x 5) Beryllium Copper Flash Brass
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RFQ
30,240
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3M CONN IC DIP SOCKET 8POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 8 (2 x 4) Beryllium Copper Flash Brass
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