Contact Finish - Mating :
2777 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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RFQ
23,640
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold Flash Tin-Lead 18 (2 x 9) Copper Alloy 80.0µin (2.03µm) Copper Alloy
824-AG31D-ES
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RFQ
43,760
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS TINLEAD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead - Tin-Lead 24 (2 x 12) Copper Alloy - Copper Alloy
816-AG12D-ES
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RFQ
14,560
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TINLEAD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead - Tin-Lead 16 (2 x 8) Copper Alloy - Copper Alloy
808-AG12SM
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RFQ
58,240
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN-LEAD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead - Tin-Lead 8 (2 x 4) Copper Alloy - Copper Alloy
Default Photo
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RFQ
79,120
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN-LEAD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead - Tin-Lead 8 (2 x 4) Copper Alloy - Copper Alloy
2-641610-4
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RFQ
65,440
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD Diplomate DL Obsolete - - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 16 (2 x 8) Phosphor Bronze 15.0µin (0.38µm) Phosphor Bronze
2-641599-4
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RFQ
23,680
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 14 (2 x 7) Phosphor Bronze 15.0µin (0.38µm) Phosphor Bronze
516-AG7D
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RFQ
35,460
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold - Gold 16 (2 x 8) Copper Alloy - Copper Alloy
Default Photo
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RFQ
30,940
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Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
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RFQ
71,460
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Harwin Inc. CONN IC DIP SOCKET 20POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
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RFQ
14,560
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Harwin Inc. CONN IC DIP SOCKET 18POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
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RFQ
63,700
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Harwin Inc. CONN IC DIP SOCKET 16POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
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RFQ
37,800
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Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
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RFQ
21,200
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Harwin Inc. CONN IC DIP SOCKET 8POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
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RFQ
78,680
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Harwin Inc. CONN IC DIP SOCKET 6POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (2 x 3) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
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RFQ
17,520
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Harwin Inc. CONN IC DIP SOCKET 20POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
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RFQ
57,200
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Harwin Inc. CONN IC DIP SOCKET 18POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
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RFQ
23,520
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Harwin Inc. CONN IC DIP SOCKET 16POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
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RFQ
43,740
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Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
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RFQ
68,700
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Harwin Inc. CONN IC DIP SOCKET 8POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
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RFQ
71,000
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Harwin Inc. CONN IC DIP SOCKET 6POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (2 x 3) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
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RFQ
71,960
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CNC Tech CONN IC DIP SOCKET 6POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 60.0µin (1.52µm) Tin 6 (2 x 3) Phosphor Bronze 60.0µin (1.52µm) Phosphor Bronze
Default Photo
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RFQ
76,740
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Samtec Inc. CONN IC DIP SOCKET 16POS GOLD IC Obsolete Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
Default Photo
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RFQ
72,100
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Samtec Inc. CONN IC DIP SOCKET 16POS GOLD IC Obsolete Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 16 (2 x 8) Beryllium Copper 30.0µin (0.76µm) Phosphor Bronze
Default Photo
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RFQ
52,820
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Lo-PRO®file, C93 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
AR20-HZL-TT
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RFQ
43,060
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Assmann WSW Components CONN IC DIP SOCKET 20POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR18-HZL-TT
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RFQ
77,440
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Assmann WSW Components CONN IC DIP SOCKET 18POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR16-HZL-TT
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RFQ
71,140
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Assmann WSW Components CONN IC DIP SOCKET 16POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR14-HZL-TT
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RFQ
38,940
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Assmann WSW Components CONN IC DIP SOCKET 14POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR08-HZL-TT
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RFQ
62,300
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Assmann WSW Components CONN IC DIP SOCKET 8POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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