Contact Finish - Post :
Contact Material - Mating :
Contact Finish Thickness - Post :
Contact Material - Post :
70 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
2-382719-1
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RFQ
64,300
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 30POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 30 (2 x 15) Beryllium Copper - Beryllium Copper
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Per Unit
$8.38
RFQ
35,960
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Aries Electronics CONN IC DIP SOCKET 30POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (2 x 15) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
Default Photo
Per Unit
$8.38
RFQ
22,640
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Aries Electronics CONN IC DIP SOCKET 30POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (2 x 15) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
Default Photo
Per Unit
$7.91
RFQ
55,560
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Aries Electronics CONN IC DIP SOCKET 30POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (2 x 15) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
Default Photo
Per Unit
$7.91
RFQ
71,880
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Aries Electronics CONN IC DIP SOCKET 30POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (2 x 15) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
Default Photo
Per Unit
$8.44
RFQ
28,860
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Aries Electronics CONN IC DIP SOCKET 30POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (2 x 15) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
Default Photo
Per Unit
$8.44
RFQ
46,920
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Aries Electronics CONN IC DIP SOCKET 30POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (2 x 15) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
Default Photo
Per Unit
$8.20
RFQ
28,620
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 30POS GOLD 127 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 30 (2 x 15) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$6.65
RFQ
23,060
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Aries Electronics CONN IC DIP SOCKET 30POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (2 x 15) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
Default Photo
Per Unit
$6.65
RFQ
76,460
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Aries Electronics CONN IC DIP SOCKET 30POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (2 x 15) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
Default Photo
Per Unit
$7.58
RFQ
19,160
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 30POS GOLD 127 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 30 (2 x 15) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$8.03
RFQ
77,660
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Aries Electronics CONN IC DIP SOCKET 30POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (2 x 15) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$8.03
RFQ
78,960
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Aries Electronics CONN IC DIP SOCKET 30POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (2 x 15) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$7.28
RFQ
64,740
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Aries Electronics CONN IC DIP SOCKET 30POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 30 (2 x 15) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
Default Photo
Per Unit
$5.78
RFQ
72,540
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Aries Electronics CONN IC DIP SOCKET 30POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (2 x 15) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.48
RFQ
74,840
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Aries Electronics CONN IC DIP SOCKET 30POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (2 x 15) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.35
RFQ
47,840
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Aries Electronics CONN IC DIP SOCKET 30POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (2 x 15) Beryllium Copper 10.0µin (0.25µm) Brass
299-93-630-10-002000
Per Unit
$4.27
RFQ
77,000
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 30POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 30 (2 x 15) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$6.70
RFQ
31,820
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Aries Electronics CONN IC DIP SOCKET 30POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30 (2 x 15) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$6.70
RFQ
43,580
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Aries Electronics CONN IC DIP SOCKET 30POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30 (2 x 15) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$6.70
RFQ
46,340
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Aries Electronics CONN IC DIP SOCKET 30POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30 (2 x 15) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$7.03
RFQ
20,260
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Aries Electronics CONN IC DIP SOCKET 30POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (2 x 15) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
Default Photo
Per Unit
$3.35
RFQ
30,400
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Aries Electronics CONN IC DIP SOCKET 30POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (2 x 15) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$6.70
RFQ
54,120
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Aries Electronics CONN IC DIP SOCKET 30POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30 (2 x 15) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$6.32
RFQ
57,120
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Aries Electronics CONN IC DIP SOCKET 30POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 30 (2 x 15) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
Default Photo
Per Unit
$2.30
RFQ
66,900
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Aries Electronics CONN IC DIP SOCKET 30POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 30 (2 x 15) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.25
RFQ
25,680
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Aries Electronics CONN IC DIP SOCKET 30POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 30 (2 x 15) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.25
RFQ
40,400
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Aries Electronics CONN IC DIP SOCKET 30POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 30 (2 x 15) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
Default Photo
Per Unit
$6.24
RFQ
52,280
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 30POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 30 (2 x 15) Beryllium Copper 200.0µin (5.08µm) Phosphor Bronze
Default Photo
Per Unit
$6.24
RFQ
69,220
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 30POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 30 (2 x 15) Beryllium Copper 200.0µin (5.08µm) Phosphor Bronze
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