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7 products
IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | Mfr. | DESCRIPTION | Series | Part Status | Packaging | Current - Supply | Operating Temperature | Package / Case | Interface | Supplier Device Package | Voltage - Supply | Standards | Function | Protocol | |
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16,080
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FTDI, Future Technology Devices International Ltd | IC USB FS I2C 10DFN | USBmadeEZ-FIFO, FT-X, X-Chip | Active | Tray | 8mA | -40°C ~ 85°C | 10-WFDFN Exposed Pad | I²C | 10-DFN (3x3) | 3.3 V ~ 5 V | USB 2.0 | Bridge, USB to I²C | USB | ||||
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73,840
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FTDI, Future Technology Devices International Ltd | IC USB FS I2C 10DFN | USBmadeEZ-FIFO, FT-X, X-Chip | Active | Digi-Reel® | 8mA | -40°C ~ 85°C | 10-WFDFN Exposed Pad | I²C | 10-DFN (3x3) | 3.3 V ~ 5 V | USB 2.0 | Bridge, USB to I²C | USB | |||
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41,300
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FTDI, Future Technology Devices International Ltd | IC USB FS I2C 10DFN | USBmadeEZ-FIFO, FT-X, X-Chip | Active | Cut Tape (CT) | 10.5mA | -40°C ~ 85°C | 10-WFDFN Exposed Pad | FT1248 | 10-DFN (3x3) | 3.3 V ~ 5 V | USB 2.0 | Bridge, USB to FT1248 | USB | ||||
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67,000
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FTDI, Future Technology Devices International Ltd | IC USB FS I2C 10DFN | USBmadeEZ-FIFO, FT-X, X-Chip | Active | Tape & Reel (TR) | 8mA | -40°C ~ 85°C | 10-WFDFN Exposed Pad | I²C | 10-DFN (3x3) | 3.3 V ~ 5 V | USB 2.0 | Bridge, USB to I²C | USB | ||||
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14,480
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ON Semiconductor | IC USB TYPE C CTLR PROGR 10MLP | - | Active | Digi-Reel® | - | -40°C ~ 85°C | 10-WFDFN Exposed Pad | USB | 10-MLP (3x3) | 3 V ~ 5.5 V | - | Controller | USB | |||
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65,160
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ON Semiconductor | IC USB TYPE C CTLR PROGR 10MLP | - | Active | Cut Tape (CT) | - | -40°C ~ 85°C | 10-WFDFN Exposed Pad | USB | 10-MLP (3x3) | 3 V ~ 5.5 V | - | Controller | USB | ||||
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38,480
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|
ON Semiconductor | IC USB TYPE C CTLR PROGR 10MLP | - | Active | Tape & Reel (TR) | - | -40°C ~ 85°C | 10-WFDFN Exposed Pad | USB | 10-MLP (3x3) | 3 V ~ 5.5 V | - | Controller | USB |