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17 products
IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | Mfr. | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Height Above Board | Material Flammability Rating | Number of Positions | Contact Finish | Pitch | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | Connector/Contact Type | FFC, FCB Thickness | Locking Feature | Cable End Type | Actuator Material | |
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47,800
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JAE Electronics | CONN FPC BOTTOM 50POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 50 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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26,160
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JAE Electronics | CONN FPC BOTTOM 40POS 0.50MM SMD | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 40 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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54,440
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|
JAE Electronics | CONN FPC BOTTOM 50POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 50 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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56,820
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|
JAE Electronics | CONN FPC BOTTOM 45POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 45 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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57,340
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JAE Electronics | CONN FPC BOTTOM 30POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 30 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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25,020
One step to sell excess stocks.Or submit Qty to get quotes
|
JAE Electronics | CONN FPC BOTTOM 50POS 0.50MM SMD | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 50 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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74,120
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JAE Electronics | CONN FPC BOTTOM 30POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 30 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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14,900
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JAE Electronics | CONN FPC BOTTOM 20POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 20 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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75,600
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JAE Electronics | CONN FPC BOTTOM 36POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 36 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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62,060
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JAE Electronics | CONN FPC BOTTOM 8POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 8 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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28,740
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JAE Electronics | CONN FPC BOTTOM 16POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 16 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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12,780
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JAE Electronics | CONN FPC BOTTOM 6POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 6 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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76,620
One step to sell excess stocks.Or submit Qty to get quotes
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JAE Electronics | CONN FPC BOTTOM 30POS 0.50MM SMD | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 30 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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36,920
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JAE Electronics | CONN FPC BOTTOM 8POS 0.50MM SMD | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 8 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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78,980
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JAE Electronics | CONN FPC BOTTOM 10POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 10 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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32,020
One step to sell excess stocks.Or submit Qty to get quotes
|
JAE Electronics | CONN FPC BOTTOM 8POS 0.50MM SMD | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 8 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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49,400
One step to sell excess stocks.Or submit Qty to get quotes
|
JAE Electronics | CONN FPC BOTTOM 40POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 40 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled |