- Manufacture :
- Part Status :
- Operating Temperature :
- Mounting Type :
- Features :
- Housing Material :
- Contact Finish Thickness - Mating :
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- Contact Material - Mating :
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12 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | Mfr. | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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GET PRICE |
17,120
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole, Right Angle, Vertical | Solder | Carrier, Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | 18 (2 x 9) | Beryllium Copper | ||
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GET PRICE |
56,780
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | 40 (2 x 20) | Beryllium Copper | ||
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GET PRICE |
64,020
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | 32 (2 x 16) | Beryllium Copper | ||
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GET PRICE |
77,680
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | 28 (2 x 14) | Beryllium Copper | ||
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GET PRICE |
62,440
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | 24 (2 x 12) | Beryllium Copper | ||
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GET PRICE |
74,100
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | 20 (2 x 10) | Beryllium Copper | ||
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GET PRICE |
13,960
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 6POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | 6 (2 x 3) | Beryllium Copper | ||
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GET PRICE |
68,600
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | 16 (2 x 8) | Beryllium Copper | ||
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GET PRICE |
16,040
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | 8 (2 x 4) | Beryllium Copper | ||
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GET PRICE |
67,880
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | 8 (2 x 4) | Beryllium Copper | ||
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GET PRICE |
16,280
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | 20 (2 x 10) | Beryllium Copper | ||
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64,480
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|
Aries Electronics | CONN SOCKET SIP 20POS TIN | 700 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Carrier, Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (1 x 20) | Phosphor Bronze |
