8 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$7.87
RFQ
12,140
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 217 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.75" (19.05mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (2 x 32) Beryllium Copper 0.070" (1.78mm) 200.0µin (5.08µm) Brass Alloy
117-93-764-41-005000
Per Unit
$4.09
RFQ
61,880
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.75" (19.05mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (2 x 32) Beryllium Copper 0.070" (1.78mm) 200.0µin (5.08µm) Brass Alloy
228-1290-00-0602J
Per Unit
$10.15
RFQ
56,880
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET ZIF 28POS GLD Textool™ Active Bulk -55°C ~ 125°C Connector Press-Fit Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polysulfone (PSU), Glass Filled 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
242-1293-00-0602J
Per Unit
$12.92
RFQ
56,700
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET ZIF 42POS GLD Textool™ Active Bulk -55°C ~ 125°C Connector Press-Fit Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polysulfone (PSU), Glass Filled 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
232-1291-00-0602J
Per Unit
$12.86
RFQ
40,760
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET ZIF 32POS GLD Textool™ Active Bulk -55°C ~ 125°C Connector Press-Fit Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polysulfone (PSU), Glass Filled 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
256-1292-00-0602J
Per Unit
$17.76
RFQ
54,960
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET ZIF 56POS GLD Textool™ Active Bulk -55°C ~ 125°C Connector Press-Fit Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polysulfone (PSU), Glass Filled 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 56 (2 x 28) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
290-1294-00-3302J
Per Unit
$22.17
RFQ
51,940
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET ZIF 90POS GLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 90 (2 x 45) Beryllium Copper 0.070" (1.78mm) 30.0µin (0.76µm) Beryllium Copper
264-1300-00-0602J
Per Unit
$16.88
RFQ
55,940
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET ZIF 64POS GLD Textool™ Active Bulk -55°C ~ 125°C Connector Press-Fit Closed Frame DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing Polysulfone (PSU), Glass Filled 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 64 (2 x 32) Beryllium Copper 0.070" (1.78mm) 30.0µin (0.76µm) Beryllium Copper
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