6 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
Default Photo
Per Unit
$58.83
RFQ
56,320
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip CONN SOCKET PGA 360POS GOLD 518 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold Flash 360 (19 x 19) Beryllium Copper
Default Photo
Per Unit
$57.75
RFQ
59,600
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip CONN SOCKET PGA 360POS GOLD 518 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold Flash 360 (19 x 19) Beryllium Copper
Default Photo
Per Unit
$57.52
RFQ
64,480
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip BGA SURFACE MOUNT 1.27MM 558 Active Bulk -55°C ~ 125°C Surface Mount Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 360 (19 x 19) Brass
Default Photo
Per Unit
$35.67
RFQ
61,280
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 360 (19 x 19) Beryllium Copper
Default Photo
Per Unit
$54.17
RFQ
74,300
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 360 (19 x 19) Beryllium Copper
Default Photo
Per Unit
$51.21
RFQ
52,620
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 360 (19 x 19) Brass
Page 1 / 1