- Mounting Type :
- Features :
- Pitch - Mating :
- Contact Finish Thickness - Mating :
8 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | Mfr. | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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33,000
One step to sell excess stocks.Or submit Qty to get quotes
|
Preci-Dip | CONN SOCKET PGA 560POS GOLD | 518 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | Flash | Gold | 560 (33 x 33) | Beryllium Copper | Flash | Brass | |||
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64,700
One step to sell excess stocks.Or submit Qty to get quotes
|
Preci-Dip | CONN SOCKET PGA 560POS GOLD | 518 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | Flash | Gold | 560 (33 x 33) | Beryllium Copper | Flash | Brass | |||
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34,160
One step to sell excess stocks.Or submit Qty to get quotes
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 560 (33 x 33) | Brass | 10.0µin (0.25µm) | Brass | |||
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12,080
One step to sell excess stocks.Or submit Qty to get quotes
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 560 (33 x 33) | Brass | 10.0µin (0.25µm) | Brass | |||
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25,900
One step to sell excess stocks.Or submit Qty to get quotes
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 560 (33 x 33) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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64,200
One step to sell excess stocks.Or submit Qty to get quotes
|
Preci-Dip | CONN SOCKET BGA 560POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 560 (33 x 33) | Beryllium Copper | - | Brass | |||
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46,460
One step to sell excess stocks.Or submit Qty to get quotes
|
Preci-Dip | CONN SOCKET BGA 560POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 560 (33 x 33) | Beryllium Copper | - | Brass | |||
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19,500
One step to sell excess stocks.Or submit Qty to get quotes
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 560 (33 x 33) | Beryllium Copper | 10.0µin (0.25µm) | Brass |
