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IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Part Status Packaging Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TINLEAD Obsolete - Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Tin-Lead 3.00µin (0.076µm) 16 (2 x 8) Beryllium Copper 5.00µin (0.127µm) Brass
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