4 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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RFQ
30,240
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 8POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 8 (2 x 4) Beryllium Copper Flash Brass
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RFQ
23,080
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 8POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 8 (2 x 4) Beryllium Copper Flash Brass
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RFQ
39,120
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 8POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 8 (2 x 4) Beryllium Copper Flash Brass
Default Photo
GET PRICE
RFQ
46,460
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 8POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 8 (2 x 4) Beryllium Copper Flash Brass
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