N3793-D302RB

MANUFACTURER
3M
PRODUCT CATEGORY
Rectangular Connectors - Headers, Male Pins
Description
CONN HEADER CONDO 20POS R/A

NO PRICE

TOTAL      0.00
We buy and resell all components & semiconductors especially shortage parts for over 15 years.
Free your excess stocks soonest or submit RFQ to get latest quotes from EGchip!
Contact us to sell your excess inventory Or to buy our stocks quickly via email: evergreen@egchip.com

Warm Tips: Please fill out the below form and we will contact you as soon as possible.

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Manufacturer :
3M
Product Category :
Rectangular Connectors - Headers, Male Pins
Connector Type :
Header, Stackable (2)
Contact Finish - Mating :
Gold
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
30.0µin (0.76µm)
Contact Length - Mating :
0.240" (6.10mm)
Contact Length - Post :
0.112" (2.84mm)
Contact Material :
Copper Alloy
Contact Shape :
Square
Contact Type :
Male Pin
Current Rating :
1A
Fastening Type :
Latch Lock/Eject Hooks, Long
Features :
Keying Slot, Mounting Flange
Ingress Protection :
-
Insulation Color :
Black
Insulation Height :
0.660" (16.76mm)
Insulation Material :
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Material Flammability Rating :
UL94 V-0
Mounting Type :
Through Hole, Right Angle
Number of Positions :
10, 10
Number of Positions Loaded :
All
Number of Rows :
2
Operating Temperature :
-55°C ~ 105°C
Overall Contact Length :
-
Packaging :
Bulk
Part Status :
Obsolete
Pitch - Mating :
0.100" (2.54mm)
Row Spacing - Mating :
0.100" (2.54mm)
Series :
3000
Shrouding :
Shrouded - 3 Wall
Style :
Board to Board or Cable
Termination :
Solder
Voltage Rating :
-
Part Number # N3793-D302RB is manufactured by 3M and distributed by EGchip. Our online stocks were excess new inventory which we bought from top and famous companies. Online Price is our recycling price for reference only. If you have surplus new stocks for this kind of parts, you can also enter into consignment transaction plan of EGchip. Contact us NOW! Being one of the leading electronics distributors, we are managing many kinds of electronic components from some of the world’s top manufacturers. To process your RFQ, please add N3793-D302RB with quantity into BOM and send us email. EGchip is recommended to be a global buyer & reseller for excess inventory of semiconductors & components from famous companies. Started from 2006, EGchip is now a reliable distributor of ST, TI, ADI, MICROCHIP, MICRON, XILINX, ALTERA etc...by covering various types of parts like : FPGA, MCU, SENSOR, MOSFET, Power, Memory, Analog, TVS. Meanwhile, similar with Rochester Electronics, we focus on the aftermarket of semiconductor industry and have buyback plan to purchase your surplus new electronic components which you do not need. EGChip can be your expert at solving your excess, obsolete, end-of-life and slow moving electronic component inventory. For any excess ic chips or semiconductors, you could just sell off them to EGchip. Each year, countless excess chip stocks are stacked in the warehouse, waiting for disposal, some are not properly preserved, which could be easily oxidized or damaged. At the same time, many companies are discontinued for the shortage of certain semiconductors. There are some bad and dishonest merchants renew and sell used/fake ic chips, which has caused many quality problems to the users. EGchip helps over 2500 enterprises to avoid these issues: Firstly: we only cooperate with famous and top enterprises of the world by purchasing their brand new surplus stocks with detailed packing information. These companies including Foxconn, Cisco, Intel, Seco and Siemens. Second, we have very strict quality supervision and inspection, only allow for qualified, brand new and newly sealed products into the market. Because of our strict quality control and reclaiming these new components, they get new life cycles. We are able to resell, distribute and recycle your components with higher value. Send us email if any request: Email: evergreen@egchip.com recycling@egchip.com
Datasheet :
N3793-D302RB

Cross References

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