Sockets for ICs, Transistors - EGchip

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4 products

IMAGE	PART NO.	PRICE (reference only)	QUANTITY		STOCK	Mfr.	DESCRIPTION	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
	100-016-001		GET PRICE	PDF RFQ	28,920 One step to sell excess stocks.Or submit Qty to get quotes	3M	CONN IC DIP SOCKET 16POS GOLD	100	Obsolete	Bulk	-65°C ~ 125°C	Through Hole	Solder	Closed Frame, Seal Tape	DIP, 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	8.00µin (0.203µm)	16 (2 x 8)	Beryllium Copper	Flash	Brass
	100-016-000		GET PRICE	PDF RFQ	19,180 One step to sell excess stocks.Or submit Qty to get quotes	3M	CONN IC DIP SOCKET 16POS GOLD	100	Obsolete	Bulk	-65°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	8.00µin (0.203µm)	16 (2 x 8)	Beryllium Copper	Flash	Brass
	100-016-051		GET PRICE	PDF RFQ	37,060 One step to sell excess stocks.Or submit Qty to get quotes	3M	CONN IC DIP SOCKET 16POS GOLD	100	Obsolete	Bulk	-65°C ~ 125°C	Through Hole	Solder	Closed Frame, Seal Tape	DIP, 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	8.00µin (0.203µm)	16 (2 x 8)	Beryllium Copper	Flash	Brass
	100-016-050		GET PRICE	PDF RFQ	62,760 One step to sell excess stocks.Or submit Qty to get quotes	3M	CONN IC DIP SOCKET 16POS GOLD	100	Obsolete	Bulk	-65°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	8.00µin (0.203µm)	16 (2 x 8)	Beryllium Copper	Flash	Brass

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Semi & E-assets with higher price!

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Electronic Components Recycling